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Schematic representation of PariPoser®
Interconnects showing
conductive columns in isolative
polymer material (a).
Features
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Anisotropically conductive polymer
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Conductive elements
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Self-registering, compliant material
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Test fixture interconnect
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Easily detachable and reusable
connections
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Highly compliant polymer matrix
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Excellent electrical properties such as,
low through resistance, short conductive length, and low inductance
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Robust, durable material; extremely
stable electrical and thermal properties
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Wide operating temperature and humidity
ranges
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Excellent Sensor Interconnect
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Excellent High Performance Display
Interconnect
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Representation of high-density interconnection
of devices using PariPoser® Interconnects
under applied load (b).
Benefits
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Conduction
of current in the vertical or Z direction only; non-conductive in the
X-Y or planar direction
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Ideal for high-density, high reliability
interconnections
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Reduces costs/labor; no need for
precision alignment of contacts
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Excellent alternative for testing
fine-pitch chip packages and bare boards with surface-mount pads;
eliminates contact wear caused by spring probes
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Recommended for testing, burn-in, and
production socketing
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Allows for non-planar interconnections;
easily cut or molded to accommodate varying dimensional sizes and
geometric configurations
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Suitable for high-frequency applications
up to 40 GHz and beyond
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Extended service life; water-washable,
withstands repeated usage
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Maintains high performance to 150°C
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