Paricon Technologies Corporation has developed a family of high performance materials specially designed for high-density electrical interconnections. These specially designed anisotropically conductive materials are referred to as PariPoser^® Interconnects. PariPoser Interconnects make electrical connections uniformly between opposing contact areas using BallWire  conductive columns, which are regularly distributed within a sheet of silicone rubber. PariPoser Interconnects are custom formulated depending on the application’s pad pitch.

Characterized by excellent thru-conductance and high in-plane isolation, the properties of PariPoser Interconnects make them an excellent choice for applications requiring fine-pitch, non-planar interconnections. The material is formulated and manufactured to provide high mechanical shock relief while maintaining superior mechanical stability over an extended service life.

PariPoser Interconnects are ideally suited for high-density I/O interconnections where soldering is difficult – such as LAND-grid-array, BALL-grid array connections and device test interconnections. Interconnections are made by simply placing the PariPoser Interconnect between the pads to be joined and applying pressure.

In addition, the quick and uncomplicated disassembly of PariPoser Interconnections facilitates scalability, field terminations, component repair, and use in test components. Since both solder and flux are eliminated, no heat damage is induced during testing or repairs, and the use of hazardous cleaning solvents is eliminated.

The primary ingredient in the standard PariPoser Interconnect is naturally resilient silicone rubber. Its elasticity allows the material to compensate for surface irregularities between adjoined components; a characteristic that lowers component and assembly costs and reduces rejection rates.

Inherently reliable and re-usable, the silicone-rubber base material features robust mechanical properties and may be used confidently in harsh environments, sealing-out contaminants. PariPoser Interconnects can be easily shaped and cut, allowing designers greater flexibility in product configuration and product changes.

PariPoser Interconnection reliability in prototype connector assemblies has been thoroughly proven by using standard testing regimens for the qualification of Bell Laboratories connectors and printed wiring boards. The capability of PariPoser Interconnects to withstand repeated high-compression excursions has been verified to 500,000 cycles (test limit) against gold-plated connectors, in laboratory conditions.

No special handling procedures are required. The material is readily cleaned with water; the surface may be air-blown to remove particle contaminants.