Test Sockets


F01 Clam Shell
Bench Top Test and Burn-In • Operating Temperature (ºC)  -50 to 150
• PariPoser Contactor • Contact Edge to Edge Gap Must Exceed 40% of Pitch
• Molded Clam Shell Style Lid • Factory Set Load
• Any Device Using Flat Pads • Device Size 10 x 10 mm and Under
• Contact Pitch Between 1.27 and 0.1 mm  
The table provides a partial list of available contacts provided by Paricon for use with the F01 Clamp. Please contact Paricon at sales@paricon-tech.com for the optimum socket for your application.


F02 Handler / Adapter
Bench Top Test and Burn-In • Device Size Under 10 x 10 mm
• PariPoser, PariProbe, Flex Contactor  • Pre-Set Load
• Removable Clamp Using Double Latch  • Device Thickness : 0.5 - 3.0mm
• Many Contact Styles including BGA, Flat Pads and Some Leaded  • Contact Edge to Edge  40%
• Contact Pitch Between 1.27 and 0.1 mm  • Operation Temp -50 - 150 C°
The table provides a partial list of available contacts provided by Paricon for use with the F02 Clamp. Please contact Paricon at sales@paricon-tech.com for the optimum socket for your application.


F03 Tower
• Bench Top Test  • Contact Pitch Between 1.27 and 0.1 mm
• PariPoser, PariProbe, Flex Contactor  • Device Size Under 20 x 20 mm
• ZIFF Clamp Using Adjustable Latch  • Factory Set Load
• Many Contact Styles including BGA, Flat Pads and Some Leaded  • Pre-Set Load, Device Thickness Compensation
 


F04 Rocker

• Bench Top Test, Burn In, HAST  • Contact Pitch Between 1.27 and 0.1 mm
• PariPoser, PariProbe, Flex Contactor  • Pre-Set Load
• ZIFF Clamp, Uniform Load over Large Area  • Device Size 10 x 10 mm to 35 x 35 mm
• Many Contact Styles including BGA, Flat Pads and Some Leaded



F05 Strip Socket

• Production Test, Burn In, HAST  • Contact Pitch Between 1.27 and 0.4 mm
• PariPoser, PariProbe, Flex Contactor  • Pre-Set Load
• Uniform Load over Large Area  • Device Size --Any
• All Strip Formats  • Pre-Set, Segmented Floating Spring Load



F06 Multi Device Sockets

• Production Test, Burn-in, HAST  • Device Size --Any
• PariPoser, PariProbe, Flex Contactor  • Pre-Set, Segmented Floating Spring Load
• Maximum Board packing Density  • Lowest Cost per Socket Device
• Contact Pitch Between 1.27 and 0.4 mm



F07 Open Probing

• Open Top for Bench Top Development  • Contact Pitch Between 1.27 and 0.4 mm
• PariPoser, PariProbe, Flex Contactor  • Device Size --Any
• Loaded From Rear for Maximum Accessibility  • Adjustable Spring Load
• All Contact Formats  



F08 Simple Clamp

• Bench Top Test, Burn In, HAST  • Contact Pitch Between 1.27 and 0.1 mm
• PariPoser, PariProbe, Flex Contactor  • Device Size-- Any
• Spring Clamp, Uniform Load over Large Area  • Adjustable Spring Load
• Many Contact Styles including BGA, Flat Pads and Some Leaded



F09 Pneumatic

• Production Bench Top Test with Superior Ergonomics  • Contact Pitch Between 1.27 and 0.4 mm
• PariPoser, PariProbe, Flex Contactor  • Fully Adjustable Pneumatic Loading
• Uniform Load over Large Area  • Heat Sink with Fan
• All Contact Types, Any Device Size



F10 Translation

• Translates Device Foot Print to Match Standard Board  • Contact Pitch Between 1.27 and 0.4 mm
• PariPoser, PariProbe, Flex Contactor  • Device Size --Any
• Bench Top Test  • Fixed Spring Load Applied with Latch
• Compatible with Most Device Contact Formats



F14 Lock-N-Load
• Handler and Bench Top Test, Burn In, HAST • Open Access for Air Stream Thermal Control
• PariPoser, PariProbe, Flex Contactor • ZIFF with Removable Lid and Calibrated Variable Load
• Device Thickness : 0.5 - 3.0mm • Contact Edge to Edge  40%
• Contact Pitch Between 1.27 and 0.1 mm • Operation Temp -50 - 150 C°

 The table provides a partial list of available contacts provided by Paricon for use with the F14 Clamp. Please contact Paricon at sales@paricon-tech.com for the optimum socket for your application.



F15 Lock-N-Load
• Handler and Bench Top Test, Burn In, HAST • Device Size - Any
• PariPoser, PariProbe, Flex Contactor • Superior Clamping Stability
• Many Contact Styles including BGA, Flat Pads and Some Leaded • Contact Pitch Between 1.27 and 0.1 mm
• Device Thickness : 0.5 - 3.0mm • Contact Edge to Edge  40%
 • Operation Temp -50 - 150 C° • ZIFF with Removable Lid and Calibrated Variable Load