F15 Lock-N-Load
| • Handler and Bench Top Test, Burn In, HAST | • Device Size - Any |
| • PariPoser, PariProbe, Flex Contactor | • Superior Clamping Stability |
| • Many Contact Styles including BGA, Flat Pads and Some Leaded | • Contact Pitch Between 1.27 and 0.1 mm |
| • Device Thickness : 0.5 - 3.0mm | • Contact Edge to Edge 40% |
| • Operation Temp -50 - 150 C° | • ZIFF with Removable Lid and Calibrated Variable Load |
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