Oct 27, 2020
This is an illustrated concept of a low-profile PariPoser® elastomer OEM socket for an LGA device or a Chiplet substrate. The stamped stainless steel retaining clips secure the device in the socket.
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The assembled socket is placed on a printed circuit board, and the device is contained in the socket using two stainless steel retaining clips. |
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The retaining clips are locked into position by latching onto the lower alignment frame. The pusher plate pushes the device onto the PariPoser® elastomer to make the electrical contact with the pads on the PCB. |
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The pusher plate has a unique shape to pass along the downward force of the retention clips onto the device or the substrate. The pusher plate can also act as a heat spreader. |
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The device or substrate is positioned in the alignment frame to make sure all the contact pads are in the right positions. The alignment frame is secured to the PCB (possibly with a supporting plate underneath the PCB) |
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When the alignment frame is removed, the device or Chiplet substrate can be seen on the PCB. |
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Removing the device, reveals the sheet of PariPoser® anisotropic conductive elastomer that makes the electrical contact between the device and the PCB. |
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The elastomer has a large number of conductive columns of silver-plated nickel particles throughout the entire sheet. The pattern and density of the columns yields 10 redundant columns per contact pad. |
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Underneath the elastomer is an array of contact pads on the PCB that matches the device or substrate. In the area of the contact pads, there is no solder mask (to facilitate good engagement of the particle columns in the elastomer) |