Nov 2, 2020
This is an illustrated concept of a low-profile PariProbe® elastomer socket for a BGA device with a requirement for water cooling.
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The assembled socket has three sections – a top section that has a water cooling feature and a device loading feature, a bottom section that houses the PariProbe contactor, and a supporting section that goes under the PCB to prevent bowing of the PCB. |
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After removing the cover plate, the water cooling channel can be seen. The top section is attached with four pins and four compression springs located in the corners of the assembly. |
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The bottom section is the PariProbe® contactor. This is the primary contact mechanism between the solder balls on the device and the PCB pads. |
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The PariProbe® contactor has crown-cut metal pins that make the transition from the round shape of the solder balls to the flat elastomer. The crown shape cradles the ball, and cuts through the tin oxide on the surface of the solder ball. |
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The contactor assembly is made of multiple layers of Kapton to properly position the metal pins and to keep them correctly oriented. The Kapton layers and the PariPoser® elastomer material on the bottom are all secured to a precision frame. |
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The elastomer has a large number of conductive columns of silver-plated nickel particles throughout the entire sheet. Wherever the pins are located, there will always be about 10 particle columns available to make the connection to the PCB. |