News & Events

News Release: Chiplet substrates now available

Nov 6, 2020

Paricon Technologies announces the availability of multilayer polyimide substrates used in Chiplet packaging, or device-testing space transformers.

The typical pitch on the wafer side of the substrate is about 50 µm. The typical pitch on the PCB side is about 0.5mm. The substrates typically have 10 routing layers and measure up to 50mm x 50mm. The pads, traces, and vias are copper.

The polyimide dielectric constant is 2.9 and the CTE is 3 ppm/°K.

Lead time is 8-10 weeks (including custom routing, mask fabrication, production, and 100% continuity testing).


A Chiplet substrate with 8,000 contact pads.


All substrates are custom. Contact for further details.

News release for Sockets for very large BGAs  

Aug 17, 2020

New case study for XILINX sockets

A new case study has been added to the Test section of the web site.

Very large BGAs pose some real challenges for test and OEM sockets. Thousands of reliable contacts need to be made. Thermal management is always a concern. And the costs can be higher than desired.

The new case study summarizes the socket features needed to work with very large BGA packages like the ones used by Xilinx and other IC manufacturers.

Xilink FPGA


PariProbe® sockets for large BGAs are usually custom designed, and can be shipped in 4-6 weeks.


Press release – COVID

May 21,2020

The State of Massachusetts (USA) began its 4-phase reopening schedule on May 18th. Manufacturing

organizations can resume their activities – as long as certain safeguards are observed.

Paricon is pleased to report that we’re back to normal – with safeguards in place for our employees and our community.

News Release: Paricon announces new UK based Sales Rep

May 1, 2020 

Paricon Technologies is pleased to announce that effective May 1, 2020, mhz Technologies has been appointed the exclusive distributor of its products for the UK, Republic of Ireland, Sweden, Denmark, Finland and Norway. Their web site is located at

Welcome to the Paricon Team.


News Release: TestConX poster presentation

Update: Conference delayed until May 10-13, 2020

Feb 24, 2020

Paricon will exhibit and present a poster at the TestConX conference in Phoenix, AZ on May 10 – 13, 2020. The topic of the poster will be wafer connectors using PariPoser® technology – a proprietary anisotropic conductive elastomer.

A schematic layup for a wafer connector

A cross section of PariPoser® material 

PariPoser® material, sockets and connectors are currently shipping with a typical 4-6 week lead time for sockets and a 1 week lead time for material.


For further information, please contact

News Release: Wafer Connectors

Oct 3, 2019 

A new article (Wafer Connectors) – has been added to the Products section of the Paricon web site. The article explains the concept of a wafer connector and offers some practical advice on how to get started. The wafer connector concept became a public topic in August 2019 when Cerebras (Los Altos, CA) announced their new single-wafer computer system.


Cerebras 215mm x 215mm Wafer Paricon Wafer Connector


Paricon’s custom wafer connectors are currently shipping with a typical 4-6 week lead time.


For further information, please contact