PariPoser® fabric presents a unique combination of features for low cost and high-performance interconnections to wafers or bare die.
The contact mechanism acts like a traditional bending beam contact, but with a few improvements:
- The particle columns are magnetically aligned and then set in the elastomer before assembly in a prober, so there is no labor-intensive loading or alignment needed.
- The particle columns bend quite easily, but retain their orientation and low contact resistance due to the lateral support of the elastomer.
- There are typically multiple redundant ball columns per pad.
- The cost is typically pennies per contact pad.