This spring-loaded, latching Clamshell Socket [F01] is a compact and efficient solution designed for small-device test, OEM, and burn-in applications. The spring-loaded hinge enables quick and easy opening of the socket cover, improving handling and throughput, while supporting devices up to 10x10mm and accommodating common package types such as LGA, QFN, BGA, and Copper Pillar. Underside pockets allow clearance for small PCB components within the socket area, and optional machined channels can be added for RF trace clearance. Standard configurations support device sizes up to 6x6mm, 8x8mm, and 10x10mm, with a socket footprint of 36mm x 25mm and height ranging from 17–43mm. Each socket includes a contactor/alignment frame with PariPoser® elastomer, a socket clamp assembly, and a support plate, delivering a reliable and space-efficient testing solution.